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Ultra-Precise Machining for Wafer Handling & Transfer System Components

Semiconductor high-precision parts processing plant

Empowering Semiconductor Fab Automation with Micron-Level CNC Manufacturing from China

In semiconductor fabs, wafer handling and robotic transfer systems ensure safe, particle-free movement of ultra-thin wafers through dozens of process steps. Whether in FOUP load ports, EFEM arms, or atmospheric robots, the core mechanical components must be extremely lightweight, durable, and dimensionally stable — even after millions of repetitive motions.

With 20+ years of experience, our factory in China specializes in the high-precision machining of robotic arms, end-effectors, linear shafts, sliders, and guide systems tailored for semiconductor wafer handling solutions.

Semiconductor high-precision parts processing plant

✔ Machining Challenges in Wafer Transfer Mechanisms

Wafer handling components must meet some of the semiconductor industry’s most critical mechanical and cleanliness requirements:

  • Micron-level positional accuracy: Deviations >±0.001mm may lead to wafer slippage, misalignment, or breakage.
  • Weight vs. rigidity balance: Robotic arms must be extremely lightweight for speed, yet strong enough to resist torsion.
  • Burr-free, smooth surfaces: To prevent particle shedding in cleanroom environments, surfaces must reach Ra ≤ 0.1μm.
  • Chemical & thermal compatibility: Materials must withstand fab chemicals, ESD environments, and moderate thermal cycles.

✔ Materials We Use – Engineered for Cleanroom Automation

We select and optimize the following materials based on functional requirements:

MaterialComponentWhy We Use It
Aluminum Alloys (6061-T6 / 7075)Arm bases, slidersLightweight, good machinability, anodizable for anti-corrosion & anti-static
Titanium & AlloysJoint links, pivotsHigh strength-to-weight ratio, corrosion resistant, ideal for high-load arms
PEEK, PTFE, PFAEnd-effectors, finger padsChemically inert, cleanroom-grade polymers, ESD-safe options available
High-Hardness Stainless Steel (SUS440C, SUS630)Precision shafts, bearing seatsExcellent dimensional stability and wear resistance
Ceramics (Alumina / Zirconia)Isolation mounts, anti-wear jointsNon-conductive, wear-resistant, ultra-smooth

✔ Our CNC and Inspection Capabilities for Robotic Parts

Our facility is optimized for manufacturing robotic and transfer system parts with ultra-tight tolerances:

  • 5-Axis CNC Machining – For complex articulated parts, with tolerance down to ±0.002mm
  • Swiss-Type Turning Centers – For small diameter precision shafts and pins (OD tolerance within 0.001mm)
  • Mirror Polishing & Deburring – Ensures no particle generation or edge chipping
  • Anodizing & Anti-static Coating – For aluminum and polymer parts, optional black hard coat
  • Ultrasonic Cleaning & Vacuum Packaging – Class 1000 cleanroom compatibility

Inspection Tools:

  • Zeiss CMM for full 3D dimensional verification
  • Roundness tester (Tokyo Seimitsu) for shafts and rotary joints
  • Surface profiler for Ra/Rz detection
  • Material traceability via SGS/COA/RoHS documents
Semiconductor high-precision parts processing plant

✔ Real-World Projects Delivered to Global Semiconductor Integrators

  • Custom aluminum robotic arm base for a German EFEM unit supplier
  • Titanium pivot joints for a Korean wafer transfer robot manufacturer
  • PEEK end-effectors for a Singaporean FOUP loadport system integrator
  • Linear rail housings delivered to cleanroom automation providers in the USA and Israel

Our team co-develops parts based on your STEP/IGES drawings, offers design-for-manufacturing feedback, and supports fast prototyping (as fast as 7 days) and production scaling.


✔ Why Semiconductor Equipment Companies Trust Us

  • 🏭 20+ Years of experience in ultra-precision machining
  • 🤖 Full support for motion-critical robotic components under ±0.001mm tolerance
  • 🌐 Exported to 30+ countries and trusted by global fabs and OEMs
  • 🧼 Cleanroom-ready with Class 1000 cleaning & packaging
  • 🛠️ Material mastery across metals, polymers, ceramics — for complex mechanisms

📦 Let’s Engineer Your Wafer Handling Components with Precision

In an industry where 1μm can make or break an entire wafer, choosing the right machining partner is mission-critical. We help you achieve flawless wafer transfer with robotic parts engineered for speed, cleanliness, and stability.

📨 Send us your drawings today and get a quote within 24 hours.

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